At the exhibition site, Hongchi Precision displayed a series of probe card products for the semiconductor industry, including SOC IC vertical probe cards, cantilever probe cards, and mixed-signal vertical probe cards!
Hongce Precision's technical department personnel interacted and communicated with visitors during the on-site period, introducing in detail our innovative solutions for products and technologies, and jointly discussed the trends in the development of the semiconductor industry in the face of increasingly strong market demand.
Founder Mr. Zheng Renxi joined the largest probe card company in Asia in 1995 and became the founding team. He represented the company to transfer Japan's MJC technology back to Taiwan. As one of the few companies in the world that can achieve the minimum pin pitch pitch 18um panel driver IC probe card, it is also the first company in Taiwan to realize the vertical probe card of MEMS micro-electromechanical system. In 2021, in response to the global trend of deglobalization and the rise of advanced packaging and testing industries such as small chips in mainland China, he and Mr. Benjamin Chen Bingqian jointly established Hongce Precision Technology in Shenzhen.
In today's domestic semiconductor industry technology is developing rapidly and urgently needs domestic substitution in the business environment, the company integrates technology and market resources in the industry and introduces technical experience and testing solutions from advanced companies in Taiwan, Japan and other places.
Provide test solutions (TURN KEY SOLUTION) to solve customer pain points and achieve the goal of one-stop service. And engage in the sales of a variety of test materials, tools and equipment components required by the semiconductor industry, serving our country's IC design, manufacturing, packaging and testing companies.
This event focuses on various sub-sectors of the semiconductor industry, showcasing the semiconductor industry chain centered on design, chips, wafer manufacturing and packaging, semiconductor-specific equipment and components, advanced materials, third-generation semiconductors/IGBTs, and automotive semiconductors/automotive-grade advanced packaging technologies.
It comprehensively showcases new technologies, new products, new highlights, and new trends in the semiconductor industry, and builds a new ecosystem for communication and integration in the semiconductor industry.
