In 2024, the semiconductor industry will usher in more innovative needs, such as the Internet of Things, artificial intelligence, advanced packaging, manufacturing technology optimization, automotive chips, 5G networks, etc. Semiconductor testing can bring semiconductor production: improve production efficiency, ensure product quality, reduce costs, verify circuit functions, ensure functionality, reliability and quality, monitor product yield and cost, and meet market demand. Even in the chip development and design stage, accurate testing must be used to shorten the chip development schedule.
Industry experts explain measurement and process issues
How to optimize semiconductor measurement and process?
What are the problems with semiconductor measurement and process?
Speaker: Chen Minfeng
Huanbang Technology Co., Ltd. From March 2003 to January 2019, Director and Executive Vice President, ADC Application Engineer, Director of Product Testing Department, Manager of Test R&D Department, more than 20 years of experience in semiconductor professional test program development and test operation management.
Test fixture design and test program development services;
Lead the company team to strategically enter the overseas market, and provide technical and production process instructions to the client; obtain domestic and foreign market business, and successfully introduce production.
CONTENT SHARING
Sharing from the seminar on test machine test program developmentMr. Chen Minfeng has more than 20 years of experience in test equipment design and testing. The main purpose of this seminar is to assist domestic DESIGN HOUSE engineers to introduce ATE (Automatic Test Equipment). In the initial IC design period, they should not only focus on improving product performance, but also consider the yield and cost of future packaging and testing, and select more suitable equipment and test interfaces. The initial test design method is wrong or the test platform is wrong. Related cases are as follows:
1. Waste of test resources: Failure to fully evaluate and optimize the allocation of ATE test board resources may lead to waste of resources. Especially for high-end testers (ex: Advantest 93K), each channel pin board is extremely expensive. For example: If a 256-pin product is designed as a 384-pin test platform, on the one hand, board resources are wasted, and on the other hand, the selection of 384-pin machines with configuration may become less.
2. Increased test costs: As above, if the test program does not fully utilize the resources of the board, more test boards may be required to complete the test tasks, thereby increasing the cost of testing. The cost of general testing (Cost Of Test) is calculated based on the configuration of the machine and its purchase cost to estimate the hourly rate. It can consider the later operating costs in the early stage of design and development, which can greatly enhance the competitiveness of the enterprise.
In summary, careful feasibility assessment and optimization of test procedures before ATE test development are crucial to ensure the efficiency, accuracy and reliability of the test process. By rationally utilizing board resources, in addition to improving test efficiency, test costs can also be reduced. In the course, Mr. Chen Minfeng listed many practical cases. In the past, many companies could not improve the final FT yield of chip production, or they could not test semi-finished CP and finished product FT due to design errors. In addition, the selection of the test platform interface caused a significant increase in the subsequent packaging and testing costs, which brought huge challenges and impacts to the company's upgrade. Therefore, it once again demonstrated the importance of having a good KNOW HOW in the early stages of product design and development.
CP Testing Process
FT Testing Process
At the same time, the core of this event is also what the invited guests are most concerned about - the corresponding solutions proposed for individual cases can help customers significantly improve the yield of CP and FT testing at the lowest cost with existing machinery and equipment, and achieve equal replacement of domestic mature solutions.
How to optimize semiconductor measurement and process?
Ⅰ. In view of the problems existing in semiconductor measurement and process, the following factors need to be considered: Different semiconductor products need different measurement and process technologies to meet different production needs.
Ⅱ. Semiconductor measurement should be involved in the development of semiconductor chips as early as possible, and some key factors of measurement and process should be considered at the beginning of semiconductor chip design.
Ⅲ. The optimization of semiconductor measurement and process is an indispensable part of the development of the semiconductor industry. Only through continuous technological improvement and innovation can we produce better quality semiconductor products and promote the development of the semiconductor industry.
The semiconductor industry emphasizes good origins. Mr. Zheng Renxi, the founder of Hongce Precision, has been engaged in semiconductor chip testing and probe card industry for 30 years. During the epidemic, he resolutely returned to the mainland to establish Hongce Precision because he was optimistic about the development of the domestic industry. Now, he has led many veterans in the testing field of Taiwan, China, to provide a complete one-stop service from test procedures, probe cards to Turnkey solution landing in China, in order to contribute to the progress of China's semiconductor industry. We also welcome leaders from all walks of life to explore more possibilities with us.
